Digital Image Correlation: Towards Standardisation and Good Practice
Seminar and Exhibition
Location: Online event
Price: BSSM and iDICs Members including students £50, Non-member £70, Membership and event package offer £100. Prices exclude VAT.
The event will take place between 1300 – 1710 GMT on both days and is hosted by the National Physical Laboratory, NPL.
This two day seminar and exhibition focuses on the increasing use of Digital Image Correlation (DIC) as a regular measurement tool in academic and industrial environments, and the challenges associated with ensuring good practices and high data quality. With several notable speakers from the community, this event will provide valuable insights into current activities, and is sure to inspire lively discussion. The event is not focussed on one particular application, but instead aims to bring together experiences from a broad range of industries. With co-sponsorship from iDICs, there will be reference to the DIC Good Practice guide, and discussion on how it fits with the various application areas. Alongside the presentations there will also be an exhibition where companies providing DIC relevant products will be present.
This event will go ahead as a virtual event via Teams over two days.
The current use of DIC in international standards for
Mark Iadicola, Mechanical Performance Group, NIST (iDICs)
DIC used outside the laboratory: examples and Issues
Nick McCormick, Principal Research Scientist, Advanced
Materials Characterisation, NPL
GOM’s approach to acceptance testing
Markus Klein, GOM GmbH
Materials performance for the hottest place in the solar system
Allan Harte, Materials Engineer, United Kingdom Atomic Energy Authority
Beyond the noise floor: an approach to the underestimated “unseen” in standardization and traceability
Pascal Lava, MatchID
How to estimate uncertainty in DIC measurements
Thorsten Siebert, LaVision
Beyond Good Practice: Standardising the Speckle
David Jesson, University of Surrey
Access the Timetable Details may be subject to change.
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